ag凯时手机版

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RH150

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产品描述

RH150

ag凯时手机版  

(UL ANSI:FR-4.1)High Performance,Mid-Tg Halogen-free

 

特点            

  1. 不含卤素、砷、红磷等成份
  2. 优良的机械加工性能和热性能,适用于无铅工艺

应用领域            
手机、便携式电子产品、笔记本电脑、检测设备、通信、网络设备

 

 FEATURES     

  1. Free of constituents such as halogen,animony,red phosphorous,ect。
  2. Excellent mechanical processibility and thermal resistance,lead free process compliancy。

 APPLICATIONS     
Mobile phone,portable electronics,notebook and PC, QA equipment, communications,network equipment

 

GENERAL PROPERTIES    

Test Item

Test condition

Units

Standard value

Typical value

1.Peel Strength , IBS/IN,Minimum,1 OZ

 

ag凯时手机版 IBS/IN

 

 

As received

A

≥8.0

10.8

After thermal stress

A

ag凯时手机版 ≥8.0

ag凯时手机版 10.8

2. Volume resistivity ,Minimum
At elevated temperature E-24/125

ag凯时手机版 E-24/125

ag凯时手机版 MΩ.cm  

ag凯时手机版 ≥103

≥107

3. Surface resistivity , Minimum                              
At elevated temperature E-24/125        

ag凯时手机版  E-24/125

≥103

≥107

ag凯时手机版 4.Water absorption , Maximum

E-1/105+des

%

≤0.50

ag凯时手机版 0.15

ag凯时手机版 5.Dielectric Breakdown, Minimum

ag凯时手机版 D-48/50 D-0.5/23

Kv

≥40

43

6. Flexural strength ,Minimum

 

Mpa

 

 

ag凯时手机版 Length direction

A

ag凯时手机版 ≥415

580

ag凯时手机版 Cross direction

A

≥345

460

7.Arc resistance ,Minimum

D-48/50
D-0.5/23

S

≥60

160

ag凯时手机版 8.Flammability

A

S

ag凯时手机版 UL-94V0

ag凯时手机版 UL-94V0

ag凯时手机版 9. Permittivity 1MHZ ,Maximum

A

 

≤5.4

4.8

ag凯时手机版 10.Loss tangent 1MHZ ,Maximum

A

---

≤0.035

ag凯时手机版 0.011

11.Thermal stress 288℃,10sec( Minimum )                    

 

---

 

 

ag凯时手机版 Non etched specimen

A

ag凯时手机版 NO DEFECT

NO DEFECT

Etched

A

ag凯时手机版 NO DEFECT

ag凯时手机版 NO DEFECT

ag凯时手机版 12. TG(DSC,℃)

A

≥150

152

13.CTE(Z-axis)

ag凯时手机版 Before Tg

ag凯时手机版 PPM/℃

≤60

45

ag凯时手机版 After Tg

ag凯时手机版 PPM/℃

≤300

240

ag凯时手机版 50-260℃

%

≤3.5

2.9

ag凯时手机版 14.T260

TMA

min

≥30

60

Note:
the treatment of letters and numerical meaning
    A - plate delivery stage
    D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

                               Warpage of                                                                               Warpage of

                              (No-treating)                                                                               (After treating:125℃ 2hr)

                

                         Peel strength

          

  ※Specimen T hickness:1.6mm single side board

PURCHASING INFORMATION    

ag凯时手机版 Thickness

Copper foil

Standard Size

0.2mm  to  3.4mm

12μm  to    105μm

1041×1245mm(41″×49″)    940×1245mm(37″×49″)
1092×1245mm(43″×49″)    

ag凯时手机版 ※ Other sheet size and thickness could be available upon request.

 

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